EPOCAP 45137-55137
EPOCAP 45137/55137 is a room temperature cure, two-component, epoxy potting and encapsulating system. This system is UL recognized for Hazardous Locations under file TVLE2.E189694 for Class I, Groups A, B, C and D; Class II, Groups E, F, and G. It is a filled system and exhibits very low shrinkage. It also has good chemical resistance to various fuels and alcohol/fuel mixtures..
Typical Uses:
45137 is designed for potting low to medium voltage electrical components. The A filled component should be stirred or agitated without introducing excessive air before use to ensure that all fillers are properly dispersed. The best cured properties are obtained by ensuring accurate proportioning and thorough mixing. EPOCAP 55137 is excellent for producing void free castings by vacuum degassing for a few minutes after mixing and pouring.
MSDS 45137-55137
Data Sheet - 45137-55137